*Many factors can affect the device thickness. Process optimizations might be necessary. Laser debonding results at 308 nm using BrewerBOND T1107 (2 µm) and BrewerBOND C1301-50 (60 µm) materials, with ...
Imec and EV Group (EVG) demonstrate a highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad ...
High-performance bonding materials like OEM-specified polyurethane and acrylic tapes are the ideal method when it comes to automotive attachment applications. Selecting the right tape for your ...
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