Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

September 03, 2026 − Chiplet architectures enable complex systems to be built by combining multiple dies within a single ...

SUNNYVALE, Calif., Sept. 3, 2025 — Today Synopsys (Nasdaq: SNPS) announced expanding Synopsys.ai™ Copilot generative AI (GenAI) capabilities for its industry-leading semiconductor design solutions, ...

Verify Device Functionality: Confirm logic, analog, RF, or memory blocks operate per specification. Characterize Parametric Performance: Measure leakage currents, threshold voltages, timing margins, ...

Cisco Systems has acquired semiconductor company Leaba Semiconductor for $350-$400 million. Leaba was established in 2014 and operates in stealth mode. According to Leaba’s website “Leaba is a fabless ...

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...