Researchers at ETH Zürich, CISPA, and New York University published a technical paper titled “Terracotta: Enabling the ...

Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow.

CFETs and buried power rails; agentic AI for EDA; 6G architecture decisions; chiplet connectivity.

Researchers at Georgia Institute of Technology published a technical paper titled “Low-loss ultra-compact photonic bends with enhanced fabrication tolerance for commercial foundry processes.” Abstract ...

Researchers at Seoul National University and Yonsei University published a technical paper titled “Monolithic three-dimensionally integrated memristor-thin-film transistor for electrically ...

Researchers at the University of California, Santa Cruz published a technical paper titled “Design Space Exploration of Backside Clock Meshes for 2 nm GAAFET BSPDN Technology.” Abstract Excerpt: ...

Geert Hellings is program director for XTCO/compute density at imec. Hellings received the Ph.D. degree Electrical Engineering from the KU Leuven, Belgium, in 2012.

Researchers at the UC Berkeley and FuriosaAI published a technical paper titled “Characterizing High Bandwidth Flash for LLM ...

Researchers at Georgia Institute of Technology, Qatar Computing Research Institute, and Purdue University published a ...

Researchers at Huazhong University of Science and Technology, Hong Kong Polytechnic University, University of California, Santa Barbara, and National University of Singapore published a technical ...

Distributed NVM supports high-endurance telemetry logging, functional safety, and time-sensitive networking where resilience ...

Orbital data centers, defense systems, quantum computing, particle physics, and advanced manufacturing are raising the bar ...