AI computing is driving demand for advanced packaging and 3D integration. Lam and imec are expanding joint R&D to accelerate manufacturing readiness. The collaboration now includes Aether® dry resist ...
Lam Research Corp. (NASDAQ: LRCX) today announced that the company will host its quarterly financial conference call and webcast on Wednesday, October 21, 2026, beginning at 2:00 p.m. Pacific... Aug ...
FREMONT, Calif., Dec. 10, 2024 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today introduced Dextro™, the semiconductor industry's first collaborative robot (cobot) designed to optimize critical ...
Lam Research Corporation Contacts: Ram Ganesh, Investor Relations, phone: 510-572-1615, e-mail: investor.relations@lamresearch.com ...
To access the webcast, visit the Investors section of Lam's website at http://www.lamresearch.com and click on the Investors/Investors Overview/Events & Presentations ...
State-of-the-art, Silicon Forest facility to support collaborative innovation with chip makers; first milestone in more than $3B planned expansion of global lab network President and Chief Executive ...
Ram Ganesh, Investor Relations, phone: 510-572-1615, e-mail: investor.relations@lamresearch.com ...
Ever open the body of your smartphone (perhaps unintentionally) and see small, black rectangles stuck on a circuit board? Those black rectangles are packaged chips. The external chip structure ...
FREMONT, Calif., June 22, 2023 /PRNewswire/ -- Semiconductor technology is critical in enabling a global digital economy. With device complexity on the rise, advanced technology scaling is harder than ...
Did you know that different patterns require different types of multiple patterning? Today’s advanced chips are more complex than ever before, with transistors and other structures that are smaller ...
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