Cincoze introduces two external power protection modules to reduce electrical interference in industrial computing systems.

Global 300mm fab investment is set to accelerate through 2029, driven by expanding semiconductor manufacturing capacity and ...

AI-driven power density is pushing advanced packaging toward thinner TIMs, lower thermal resistance, and new material ...

NVIDIA and industry partners are applying accelerated computing and AI agents to chip simulation, process optimization, ...

TrendForce projects 38% annual growth as six suppliers develop VCSEL-based near-packaged optics for high-speed data center ...

Hardware-based identity and attestation are critical to protecting credentials and workloads as AI agents gain autonomy ...

The investment will add picking capacity and automated packing systems at DigiKey's Minnesota distribution center over 18 ...

Rising chip costs and computing demands are driving automakers toward specialized AI architectures for more affordable, ...

GlobalFoundries is investing €1.1 billion in Dresden capacity expansion while developing FDX Fusion for energy-efficient ...

New portable VNA and reflectometer brings laboratory-grade magnitude and phase measurement to the DUT, powered and controlled ...

Global semiconductor sales reached $159.7 billion during the month of August 2026, an increase of 8% compared to the July ...

Global datacenter power demand capacity will reach 161GW in 2026, up by 31% YoY, mainly driven by AI servers. Cloud service ...