Under the partnership, CAST will promote and make available Shikino High-Tech’s IP cores worldwide, beginning with imaging and compression technologies such as JPEG-XL and potentially expanding into ...

German's Wacker Chemie said 2025 sales are likely to increase from last year due to growth across regions and a surge in ...

New research from materials scientist Chris Van de Walle illuminates the path to superior electro-optic performance in ...

On Tuesday, semiconductor equipment company ASML Holding (NASDAQ:ASML) and imec announced a new strategic partnership deal ...

Aeluma will showcase its latest advancements in AI-driven photonics, quantum computing, and advanced sensing solutions at ...

The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc. MaxSiC™ is a trademark of MaxPower Semiconductor, Inc. Registration pending. IHLE, ThermaWick, Power Metal Strip and eSMP are ...

The semiconductor industry, which is characterized by its cyclical nature, is once again on the verge of an uptrend, driven by the artificial intelligence (AI) revolution. AI is experiencing a massive ...

Innovative electrode material enhances 2D semiconductor image sensors, overcoming resistance issues and boosting optical signal efficiency for next-gen imaging.

ASML and imec, a research and innovation hub in nanoelectronics and digital technologies, have announced announced a strategic partnership agreement, focusing on research and sustainability.

ASML and imec sign strategic partnership agreement to support semiconductor research and sustainable innovation in Europe Veldhoven (the ...

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Co-packaged optics require hybrid testing systems with reliable alignment techniques that can handle both electrical and optical signals simultaneously.