Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delive…
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Plasma etch: where science meets precision. Using plasma, chipmakers can carve microscopic patterns on a wafer. Learn how our plasma etch systems define the pathways that bring advanced technology to life. https://bit.ly/4mji5qd | Lam Research Corporation
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How our HAR etch solutions enable 3D NAND and DRAM | Lam Research posted on the topic | LinkedIn
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2.6K views · 54 reactions | Our proprietary etch technology suite — Akara® — supports the production of high-performance, high-density chips. Integrated on Lam’s high-productivity Sense.i® platform, Akara leverages Equipment Intelligence® solutions for automated maintenance to reduce overall equipment upkeep. Learn more. https://bit.ly/4i5iURo | Lam Research Corporation | Facebook
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As 3D NAND technology advances, the demand for greater deposition and etch intensity grows. Adding more memory layers requires not only innovative engineering but also precise material deposition and enhanced etch techniques. See how applying stress-compensating materials and leveraging molybdenum for improved conductivity ensure reliable scaling and more in the video below. | Lam Research Corporation
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